6月3日至5日，第十九届国际太阳能光伏和智慧能源大会暨展览会（以下简称“SNEC”）在上海举行。全球领先的超短距毫米波芯片设计公司——德氪微电子（深圳）有限公司（以下简称“德氪微”）现场展示了其自研的毫米波无线隔离芯片与模组。

From June 3rd to 5th, the 19th International Solar Photovoltaic and Smart Energy Conference and Exhibition (hereinafter referred to as "SNEC") was held in Shanghai. The world's leading company for ultra-short-range millimeter-wave chip design - Deku Microelectronics (Shenzhen) Co., Ltd. (hereinafter referred to as "Deku Micro") showcased its self-developed millimeter-wave wireless isolation chips and modules on-site.

相关产品及应用方案可用于光伏逆变器、储能变流器、充电模块、高压变频器、SST 固态变压器及高压工业电源等场景，为光伏与储能系统在高电压、高频率和强共模干扰环境下构建更安全、更稳定的隔离链路提供新的芯片级路径。

The related products and application solutions can be used in scenarios such as photovoltaic inverters, energy storage converters, charging modules, high-voltage frequency converters, SST solid-state transformers, and high-voltage industrial power supplies, providing a new chip-level path to build a safer and more stable isolation link for photovoltaic and energy storage systems in high-voltage, high-frequency, and strong common-mode interference environments.

作为全球光伏与智慧能源领域具有重要影响力的行业展会之一，SNEC 集中呈现了光伏、储能、电池技术、智慧能源及相关电力电子产业链的最新进展。本届展会现场，光伏逆变器、储能 PCS、充电模块、功率半导体和新型电力系统方案集中亮相，也反映出光伏行业正加速向光储融合、高效功率转换和系统级能源管理延伸。

As one of the influential industry exhibitions in the global photovoltaic and smart energy sector, SNEC showcases the latest advancements in photovoltaics, energy storage, battery technology, smart energy, and related power electronics supply chain. At this year's exhibition, photovoltaic inverters, energy storage PCS, charging modules, power semiconductors, and new power system solutions were prominently displayed, reflecting that the photovoltaic industry is accelerating its development towards integration of photovoltaics and energy storage, efficient power conversion, and system-level energy management.

在这一趋势下，光伏与储能系统持续向更高电压、更高功率密度和更高转换效率演进。SiC、GaN 等第三代半导体器件的应用，进一步提升了系统开关频率、dv/dt 水平和电磁环境复杂度，也对隔离器件的耐压能力、CMTI、传输延迟、寄生参数控制、局部放电可靠性和长期稳定性提出了更高要求。

Under this trend, photovoltaic and energy storage systems continue to evolve towards higher voltages, higher power densities and higher conversion efficiencies. The application of third-generation semiconductor devices such as SiC and GaN has further enhanced the switching frequency, dv/dt levels and complexity of the electromagnetic environment of the system, and has also raised higher requirements for the withstand voltage, CMTI, transmission delay, parasitic parameter control, local discharge reliability and long-term stability of isolation devices.

德氪微此次展示的毫米波无线隔离芯片与模组，基于超短距毫米波非接触传输架构，可在隔离屏障两侧实现高速信号传输。该技术以无线方式完成隔离链路中的信号跨越，在满足高压隔离需求的同时，兼顾低延迟、高 CMTI 和长期可靠性，适用于隔离驱动和高速数字隔离等关键环节。

The millimeter-wave wireless isolation chip and module showcased by Dekuwei this time are based on an ultra-short-range millimeter-wave non-contact transmission architecture. They can achieve high-speed signal transmission on both sides of the isolation barrier. This technology completes the signal crossing in the isolation link wirelessly, meeting the requirements of high voltage isolation while also considering low latency, high CMTI and long-term reliability. It is suitable for key sections such as isolation drive and high-speed digital isolation.

在核心性能方面，德氪微毫米波无线隔离产品已实现 TDDB 10 kVrms 连续测试 4 个月零失效，通过 30 kVrms 浪涌测试、25 kVrms / 60 s 隔离耐压测试，同时 CMTI 实测值达到 400 kV/μs。围绕高压、高频、高 dv/dt 应用需求，德氪微也在展会现场重点呈现了其在寄生参数控制、局部放电可靠性及长期高压可靠性等方面的技术探索。

In terms of core performance, the DeKro millimeter-wave wireless isolation products have achieved 4 months of continuous testing at TDDB 10 kVrms without failure. They have passed 30 kVrms surge tests and 25 kVrms / 60 s isolation withstand voltage tests. Meanwhile, the CMTI measured value has reached 400 kV/μs. Focusing on high-voltage, high-frequency, and high dv/dt application requirements, DeKro Micro also presented its technical explorations in aspects such as parasitic parameter control, local discharge reliability, and long-term high-voltage reliability at the exhibition site.

面向第三代半导体及高压电力电子应用，德氪微毫米波无线隔离产品可支持 GaN、SiC 等功率器件驱动及高压信号隔离需求。针对 GaN 高频应用，相关方案可支持 1–2 MHz 及更高频率应用；针对 SiC 中高压应用，可满足高压隔离、低延迟和高可靠驱动需求。展会现场，德氪微结合光伏逆变器、储能变流器、充电模块、高压变频器及 SST 固态变压器等应用拓扑，呈现毫米波无线隔离芯片与模组在不同系统架构中的部署方式及应用优势。

For the third-generation semiconductor and high-voltage power electronic applications, the micro-millimeter wave wireless isolation products of Deku can support the drive of power devices such as GaN and SiC, as well as the isolation of high-voltage signals. For GaN high-frequency applications, the related solutions can support applications ranging from 1–2 MHz to higher frequencies; for SiC medium-high voltage applications, they can meet the requirements of high-voltage isolation, low latency and high reliability drive. At the exhibition site, Deku micro combined the application topologies of photovoltaic inverters, energy storage converters, charging modules, high-voltage frequency converters and SST solid-state transformers, presenting the deployment methods and application advantages of millimeter wave wireless isolation chips and modules in different system architectures.

随着光伏与储能系统向高效率、小型化和高可靠方向演进，隔离器件正在成为影响系统安全裕量、抗扰能力和长期稳定性的关键环节。德氪微将毫米波非接触传输技术引入隔离器件设计，为光储及更广泛的高压、高频电力电子系统提供新的芯片级隔离方案。

As photovoltaic and energy storage systems evolve towards higher efficiency, miniaturization and higher reliability, isolation devices are becoming a key factor affecting the safety margin, anti-interference capability and long-term stability of the systems. Deku Micro has introduced millimeter-wave non-contact transmission technology into the design of isolation devices, providing a new chip-level isolation solution for photovoltaic storage and a wider range of high-voltage and high-frequency power electronic systems.